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Impacts of channel implantation on performance of static shielding diodes and static induction rectifiers

机译:通道注入对静态屏蔽二极管和静态感应整流器性能的影响

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SSDs and SI rectifiers were fabricated controlling the channel dosage with ion implantation processes, and impacts of the channel dosage on the performance of these rectifiers have been investigated. It has been made clear that the reverse recovery times of these rectifiers are improved by decreasing the channel dosage without increasing the forward voltage drop. This is because the decrease of the channel dosage enhances the electron current flowing through the channel, while it reduces the amount of the holes injected from the anode electrode. Although the recovery times of the SI rectifiers are smaller than those of the SSDs, the blocking voltages of the SI rectifiers are smaller than those of the SSD at the low channel dosages. This result suggests that, for the SI rectifier, depth of the anode n/sup +/ region must be shallow enough to suppress the punchthrough breakdown.
机译:制作了通过离子注入工艺控制沟道剂量的SSD和SI整流器,并研究了沟道剂量对这些整流器性能的影响。已经清楚的是,通过减少沟道剂量而不增加正向电压降来改善这些整流器的反向恢复时间。这是因为沟道剂量的减少增强了流过沟道的电子电流,同时减少了从阳极电极注入的空穴的数量。尽管SI整流器的恢复时间小于SSD的恢复时间,但在低通道剂量下,SI整流器的阻塞电压要小于SSD的阻塞电压。该结果表明,对于SI整流器,阳极n / sup +/-区域的深度必须足够浅以抑制穿通击穿。

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