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Novel thin film polymer foaming technique for low and ultra low-k dielectrics

机译:适用于低介电常数和超低介电常数的新型薄膜聚合物发泡技术

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摘要

The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (< 300 /spl deg/C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids.
机译:结果显示了一种通过发泡技术制备基于商业和“非异国”(非昂贵)聚酰亚胺的薄超低k聚合物膜的新途径。依赖于机械和热稳定(<300 / SPL DEG / C)膜的聚酰亚胺的玻璃化转变温度具有Ca的孔隙率。形成40%和k值为2.0。通过将孔的形状从球面剪裁到盘状空隙中,可以通过将孔的形状剪裁到圆盘状空隙来实现进一步的降低。

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