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A bumpy journey with GaAs IC foundries in Taiwan and new perspectives of HBT technology readiness for wireless communications in Asia Pacific market

机译：台湾GaAs IC代工厂商的坎journey之旅以及HBT技术在亚太市场为无线通信做好准备的新观点

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This paper reviews a commercial available InGaP-HBT technology in the region that yields linear power amplifiers for IEEE 802.11a/b/g applications. A few examples of product-oriented power amplifiers and building blocks with rf performance are discussed for multimode GSM/GPRS and future trend of PA development for EDGE and WCDMA.

机译：本文回顾了该地区的商用InGaP-HBT技术，该技术可为IEEE 802.11a / b / g应用提供线性功率放大器。讨论了具有射频性能的面向产品的功率放大器和积木的一些示例，以及用于GSM和GSM的多模式以及EDGE和WCDMA的PA发展的未来趋势。

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《》|2005年|p.1230-1235|共6页
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Li-Wu Yang; Chi; T.; Wang; D.; Huang; E.;
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中图分类无线电电子学、电信技术;
关键词
heterojunction bipolar transistors; power amplifiers; cellular radio; packet radio networks; radiofrequency integrated circuits; III-V semiconductors; gallium arsenide; indium compounds; IEEE standards; IC foundries; HBT technology readiness; wireless communications; Asia Pacific market; linear power amplifiers; IEEE 802.11a/b/g; rf performance; multimode GSM; multimode GPRS; EDGE; WCDMA; GaAs; InGaP;

机译：异质结双极晶体管;功率放大器;蜂窝无线电;分组无线电网络;射频集成电路; III-V半导体;砷化镓;铟化合物; IEEE标准; IC代工厂; HBT技术准备就绪;无线通信;亚太市场;线性功率放大器; IEEE 802.11a / b / g;射频性能;多模GSM;多模GPRS; EDGE; WCDMA; GaAs; InGaP;

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专利

1. Application of GaInP/GaAs DHBTs to power amplifiers for wireless communications [J] . Pin-Fan Chen, Hsin U.-M.T. IEEE Transactions on Microwave Theory and Techniques . 1999,第8期

机译：GaInP / GaAs DHBT在无线通信功率放大器中的应用
2. Class-E GaAs HBT power amplifier with passive linearization scheme for mobile wireless communications [J] . UTHIRAJOO ESWARAN, HARIKRISHNAN RAMIAH, JEEVAN KANESAN, Turkish Journal of Electrical Engineering and Computer Sciences . 2014,第5期

机译：具有无源线性化方案的E类GaAs HBT功率放大器，用于移动无线通信
3. Metal Casting Technologies Asia Pacific Magazine welcomes readers in the Thai Foundry Association and Pakistan Foundry Association [J] . Metal Casting Technologies . 2012,第2期

机译：《金属铸造技术亚太》杂志欢迎泰国铸造协会和巴基斯坦铸造协会的读者
4. A bumpy journey with GaAs IC foundries in Taiwan and new perspectives of HBT technology readiness for wireless communications in Asia Pacific market [C] . Li-Wu Yang, Chi T., Wang D., International Conference on Solid-State and Integrated Circuits Technology . 2005

机译：亚洲太平洋市场在台湾的Gaas IC成像和HBT技术准备的新视角，在亚太市场的无线通信的新视角
5. Strategic evaluation of emerging technologies in the semiconductor foundry industry (Special case: Semiconductor foundry industry in Taiwan) (China). [D] . Ho, Chien-Te. 2004

机译：半导体铸造行业新兴技术的战略评估（特殊情况：台湾的半导体铸造行业）（中国）。
6. An Asian Perspective: The dataset for validation of Teachers’ Information and Communication Technology Access (TICTA) [O] . Lantip Diat Prasojo, Akhmad Habibi, Sutrisna Wibawa, 2020

机译：亚洲视角：用于验证教师信息和通信技术访问（TICTA）的数据集
7. GaAs microwave power HBTs for mobile communications [O] . Achouche M., Kraus S., Spitzbart T., 1999

机译：用于移动通信的GaAs微波功率HBT

A bumpy journey with GaAs IC foundries in Taiwan and new perspectives of HBT technology readiness for wireless communications in Asia Pacific market

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