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Characterization of 4H-SiC MOSFET Interface Trap Charge Density Using a First Principles Coulomb Scattering Mobility Model and Device Simulation

机译:使用第一原理库仑散射迁移率模型和器件仿真表征4H-SiC MOSFET接口陷阱电荷密度

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We have developed a physics based device simulator for detailed numerical analysis of 4H-SiC MOSFETs. As part of the drift diffusion model implemented in the simulator, a first principles quasi-2D Coulomb scattering mobility model for SiC MOSFETs has been developed. This Coulomb scattering mobility model takes into account scattering by occupied interface traps, scattering by fixed oxide charges, distribution of mobile carriers inside the inversion layer, screening by mobile carriers and temperature. Using this mobility model it has been shown that Coulomb scattering plays a dominant role very close to the interface. The interface trap density of states profile has been extracted by comparing simulated I-V curves to experimental data for room temperature. Simulations show that interface trap density of states is low in the midgap region and very high near the conduction band edge in 4H SiC, and it severely limits device performance.
机译:我们已经开发了基于物理学的器件仿真器,可以对4H-SiC MOSFET进行详细的数值分析。作为在模拟器中实现的漂移扩散模型的一部分,已经开发出用于SiC MOSFET的第一原理准2D库仑散射迁移率模型。该库仑散射迁移率模型考虑了由占据的界面陷阱引起的散射,由固定的氧化物电荷引起的散射,在反型层内部的活动载流子的分布,活动载流子的屏蔽和温度。使用这种迁移率模型,已经表明库仑散射在非常靠近界面的位置起着主导作用。通过将模拟的I-V曲线与室温下的实验数据进行比较,可以提取出状态陷阱的界面分布密度。仿真表明,在4H SiC中,能隙区域的界面陷阱态密度很低,而在导带边缘附近则非常高,这严重限制了器件的性能。

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