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Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications

机译:用于未来低成本,微型尺寸,WLAN收发器模块应用的单芯片RF前端MMIC解决方案

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Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4/spl times/4 mm or 5/spl times/5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors, and all biasing and matching circuitry. The RF FEMs replace over 30 discrete and IC components with a single package, and require practically no external components. They have the smallest footprint of any 802.11 FEM on the market and allow significant cost savings at the system level by reducing parts count, simplifying assembly, and increasing yield.
机译:描述了几种用于802.11 b / g和a / b / g应用的高度集成的RF前端模块(FEM)。这些FEM采用4 / spl乘以/ 4 mm或5 / spl乘以/ 5 mm的QFN封装,包括线性功率放大器,低噪声放大器,T / R分集开关,滤波器,双工器,功率检测器,以及所有偏置和匹配电路。 RF FEM用一个封装即可替代30多个分立和IC组件,并且几乎不需要外部组件。它们具有市场上所有802.11 FEM中最小的占用空间,并通过减少零件数量,简化组装和提高产量,在系统级显着节省了成本。

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