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A miniaturized PIFA utilizing via-patch loading

机译:A miniaturized pi fa utilizing via-patch loading

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摘要

This paper presents a new alternative of miniaturizing a planar inverted F antenna (PIFA). A via-patch is introduced under the main radiating element to create a capacitive coupling effect and lower the operating frequency. The antenna size is reduced by half when compared to the conventional PIFA. Further size reduction can be achieved by meandering the main radiating patch or the via-patch. Simulation and measurement results are presented.
机译:本文提出了一种小型化平面倒F天线(PIFA)的新选择。在主辐射元件下方引入通孔贴片,以产生电容耦合效应并降低工作频率。与传统的PIFA相比,天线尺寸减小了一半。通过弯曲主辐射贴片或通孔贴片,可以进一步减小尺寸。给出了仿真和测量结果。

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