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A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials

机译:一种评估吸湿率对印刷电路板材料介电常数和损耗因子的影响的方法

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摘要

In this article a new method to evaluate, effects of moisture absorption on dielectric constant and dissipation factor in function of temperature and frequency are presented. The development of method is based on the experimental measurements and the use of ring resonator structures implemented to FR4-type material. The experimental measurement procedure was carried out at frequency range from 1 GHz to 10 GHz. The used temperature points were 23/spl deg/C and 85/spl deg/C. The results gained by the presented method were observed to be reproducible and consistent with the amount of the absorbed moisture. The method can be applied to different printed circuit board materials.
机译:在本文中,提出了一种评估水分吸收对介电常数和耗散因数的影响的温度和频率函数的新方法。方法的开发基于实验测量和对FR4型材料实施的环形谐振器结构的使用。实验测量程序在1 GHz至10 GHz的频率范围内进行。所使用的温度点是23 / spl℃/℃和85 / spl℃/℃。观察到通过所提出的方法获得的结果是可再现的,并且与吸收的水分的量一致。该方法可以应用于不同的印刷电路板材料。

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