copper; thin film circuits; thin film capacitors; thin film inductors; thin film resistors; electronics packaging; flip-chip devices; passive filters; UHF filters; organic compounds; Bluetooth; thin film multi layer systems; multi chip module substrates; flip chip mountable integrated passive devices; passive component thin film integration; discrete passive components; packaging technologies; inductors; resistors; capacitors; passive filter structures; thin film build up; benzocyclobutene; BCB; wafer level packaging; integrated coils; Bluetooth band filter element; 2.4 GHz; Cu;
机译:使用薄膜技术进行3D集成的集成无源器件的电气特性
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机译:HTs薄膜:无源微波元件和系统集成问题