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Investigation of flow and heat transfer of an impinging jet in a cross-flow for cooling of a heated cube

机译:研究横流中冲击射流的流动和传热,以冷却加热的立方体

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The current trends towards the greater functionality of electronic devices are resulting in a steady increase in the amount of heat dissipated from electronic components. Forced channel flow is frequently used to remove heat at the walls of the channel where a PCB with a few high heat dissipating components is located. The overall cooling strategy thus must not only match the overall power dissipation load, but also address the requirements of the "ho" components. In combating the whole thermal load with forced channel flow, excessive flow rates will be required. The objective of this study is to investigate if targeted cooling systems, i.e. an impinging jet in combination with a low velocity channel flow can improve the thermal performance of the system. The steady-state 3-D model is developed with the Reynolds-Stress-Model (RSM) as turbulence model. The geometrical case is a channel with a heated cube in the middle of the base plate and two inlets, one horizontal channel flow and one vertical impinging jet. The numerical model is validated against experimental data obtained from three well-known cases, two cases with impinging jet on a flat heated plate and one case with a heated cube in a single channel flow. The effects of the jet Re and jet to-cross-flow velocity ratio are investigated. The airflow pattern around the cube and the surface temperature of the cube as well as the mean values and local distributions of the heat transfer coefficient are presented.
机译:电子设备的更大功能的当前趋势导致从电子部件散发的热量的稳定增加。强制通道流动经常用于在通道壁上散发热量,在该通道壁上有一些具有高散热成分的PCB。因此,整体冷却策略不仅必须与整体功耗负载相匹配,而且必须满足“ ho”组件的要求。在用强制通道流动来抵抗整个热负荷的过程中,将需要过大的流速。这项研究的目的是研究目标冷却系统(即撞击射流与低速通道流量的组合)是否可以改善系统的热性能。使用雷诺-应力模型(RSM)作为湍流模型开发了稳态3-D模型。几何形状的情况是一个通道,在基板的中间有一个加热的立方体,有两个入口,一个水平通道流和一个垂直冲击射流。该数值模型是根据从三种众所周知的情况获得的实验数据进行验证的,其中两种情况是在平板加热板上撞击射流,另一种情况是在单通道流动中带有加热立方体。研究了射流Re和射流与横流速度比的影响。给出了立方体周围的气流模式和立方体的表面温度,以及传热系数的平均值和局部分布。

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