首页> 外文会议> >Improved thermal stability and device performance of ultra-thin (EOT>10 /spl Aring/) gate dielectric MOSFETs by using hafnium oxynitride (HfO/sub x/N/sub y/)
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Improved thermal stability and device performance of ultra-thin (EOT>10 /spl Aring/) gate dielectric MOSFETs by using hafnium oxynitride (HfO/sub x/N/sub y/)

机译:通过使用氮氧化ha(HfO / sub x / N / sub y /)改善超薄(EOT> 10 / spl Aring /)栅极电介质MOSFET的热稳定性和器件性能

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摘要

Hafnium oxynitride (HfO/sub x/N/sub y/) film was prepared and characterized for gate dielectrics application with EOT>10 /spl Aring/ for the first time. Thermal stability and crystallization during the subsequent thermal process were improved significantly by using HfO/sub x/N/sub y/ over HfO/sub 2/. Furthermore, excellent transistor characteristics were obtained for both p and nMOSFETs.
机译:制备了氮氧化((HfO / sub x / N / sub y /)膜,并首次将其用于EOT> 10 / spl Aring /的栅极电介质应用。通过使用HfO / sub x / N / sub y /超过HfO / sub 2 /,可以显着提高后续热处理过程中的热稳定性和结晶度。此外,p和nMOSFET均获得了出色的晶体管特性。

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