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An experimental study of liquid jet impingement cooling of electronic components with and without boiling

机译：电子元件带或不带沸腾的液体射流冲击冷却实验研究

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来源
《》|2001年|P.369-375|共7页
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作者
Yang Cheng; Tay; A.A.O.; Xue Hong;
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中图分类无线电电子学、电信技术;
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An experimental study of liquid jet impingement cooling of electronic components with and without boiling

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