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The new millennium: wireless technologies for a truly mobile society

机译:新千年:无线技术打造真正的移动社会

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Universal access to a wide range of telecommunication services, from speech over multimedia to navigation and mobile computing, must be provided for the mobile society of the next millennium. The backbone of this scenario is a worldwide high-bandwidth wireless system. The wireless terminals of the next millennium, comprising all conceivable services in small size with long operating time require significant improvements in all underlying technologies as well as new architectures and new development strategies and design tools. The computing power needed from several tens of millions transistors at high clock rates requires new approaches simultaneously to allow maximum performance and minimum leakage current. Revived conversion principles like direct downconversion start to be seen in volume production. These concepts put most selection into baseband, avoiding a SAW filter and drastically reducing the number of RF blocks. Power amplifiers still use expensive GaAs HBTs. New concepts will improve power-added efficiency and give GaAs a push. For low-transmit-power applications, silicon PAs with higher performance and lower cost soon will be feasible. MEMS technologies will allow integration of mechanical antenna switches as well as other discrete RF circuitry. The remaining discretes will be integrated by advanced packaging technologies such as subsystem assembly, multi-chip or system module packages. With present growth rates, the sales of wireless terminals will exceed those of computers and internet nodes. These terminals will drive CMOS technology.
机译:必须为下一个千年的移动社会提供从多媒体语音到导航和移动计算的广泛电信服务的普遍接入。这种情况的骨干是全球范围内的高带宽无线系统。下一个千年的无线终端包括所有可能的小尺寸服务和较长的运行时间,需要对所有基础技术以及新的体系结构,新的开发策略和设计工具进行重大改进。数千万个晶体管在高时钟速率下所需的计算能力需要同时采用新方法,以实现最佳性能和最小泄漏电流。批量生产中开始看到像直接下变频这样的复兴式转换原理。这些概念将大多数选择放到了基带中,从而避免了SAW滤波器,并大大减少了RF模块的数量。功率放大器仍使用昂贵的GaAs HBT。新概念将提高功率附加效率并推动GaAs的发展。对于低发射功率的应用,具有更高性能和更低成本的硅功率放大器将很快成为现实。 MEMS技术将允许集成机械天线开关以及其他分立的RF电路。其余的分立器件将通过先进的封装技术进行集成,例如子系统组装,多芯片或系统模块封装。以目前的增长率,无线终端的销售额将超过计算机和互联网节点的销售额。这些端子将驱动CMOS技术。

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