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Pixelless imaging by transmissive quantum-well infrared photodetectors integrated with light emitting diodes

机译:集成了发光二极管的透射式量子阱红外光电探测器实现的无像素成像

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Summary form only given. The maturity of III-V materials in terms of growth and microfabrication has been a strong incentive for the development of III-V based infrared focal plane arrays (FPA). Quantum-well infrared photodetectors (QWIP) are proposed commercially and today, the efforts shift towards multicolor applications. The QWIP FPA technology is based on the conventional hybridization of a pixellated QWIP to a Si readout circuit. To circumvent the hybridization we are exploring a different approach that consists in reading the photocurrent map optically. We have proposed to put, during the epitaxial growth, a QWIP stack in series with a near-infrared light emitting diode (LED). In 1995, single QWIP-LED up-conversion elements have been demonstrated and, in 1997, large area, un-pixellated devices have demonstrated the up-conversion of far-infrared scenes to near-infrared images which are read by Si CCD arrays. Since then, the image transfer quality has been improved and new designs have been discussed.
机译:仅提供摘要表格。 III-V材料在生长和微细加工方面的成熟一直是基于III-V的红外焦平面阵列(FPA)开发的强大动力。量子阱红外光电探测器(QWIP)已在商业上提出,如今,努力已转向多色应用。 QWIP FPA技术基于像素化QWIP与Si读出电路的常规混合。为了规避杂交,我们正在探索另一种方法,该方法包括光学读取光电流图。我们建议在外延生长期间,将QWIP堆叠与近红外发光二极管(LED)串联。 1995年,展示了单个QWIP-LED上转换元件; 1997年,大面积,未像素化的设备展示了将远红外场景上转换为Si CCD阵列读取的近红外图像。从那时起,图像传输质量得到了改善,并且讨论了新的设计。

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