Fabrication of 10 Gbps laser diode module using laser welding technique

摘要

The packaging of semiconductor optical devices in applications which require high coupling efficiencies as well as high reliability remains a challenging area. Especially for applications to 10 Gbps optical communication systems, module design and assembly are very important in terms of electrical, optical, and mechanical stability. In this paper, we discuss the fabrication of a 10 Gbps direct intensity modulated laser diode module using proper package design and laser welding techniques for the inhomogeneous materials of Cu-W and stainless steel (SUS304L).