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Potential hazards associated with photocuring dentin bonding agents

机译:光固化牙本质粘接剂的潜在危害

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Summary form only received as follows: Light sources used to cure dental restorative materials have improved greatly with many of them having intensities approaching 800 mW/cm/sup 2/. Because of the increased light intensity, the potential for exposing pulpal tissues to elevated temperatures is greater. The objective of this study was to measure the temperature rise associated with curing a dentin adhesive ProBond (Caulk Dentsply, Milford, DE) and a composite Z-100 (3M, St. Paul, MN) using an Optilux Model 401 light curing unit (Demetron Research Corp., Danbury, CT). The experimental set up consisted of a stainless steel mold having a diameter of 6 mm x 3 mm depth placed over a mylar strip and a type J thermocouple. The assembly was held at 37/spl deg/C. Three sets of measurements were taken in triplicate for the conditions: A) no material; B) bonding agent; C) bonding agent + 2 mm composite. Temperatures were recorded after exposure to the light for 10, 20, 30 and 40 seconds and are given in a table. The temperature increase was significant for each group. The largest temperature increase was 42.5/spl deg/C when no material was present. Placement of the bonding agent gave a maximum temperature increase of 31.6/spl deg/C while curing of the composite gave only a 9.5/spl deg/C increase due to its ability to act as an insulator. These results suggest that curing of bonding agents in deep restorations may expose the dentin surface to significant temperature increases even though the light source may be 3 mm from the exposed surface.
机译:仅收到以下摘要表格:用于固化牙齿修复材料的光源已经大大改善,其中许多光源的强度接近800 mW / cm / sup 2 /。由于增加的光强度,使牙髓组织暴露于高温的可能性更大。本研究的目的是使用Optilux 401型光固化装置(Protin)来测量与固化牙本质粘合剂ProBond(Caulk Dentsply,Milford,DE)和复合Z-100(3M,St.Paul,MN)相关的温度升高( Demetron Research Corp.(位于康涅狄格州丹伯里)。实验装置由一个直径为6 mm x 3 mm的不锈钢模具放在一个聚酯薄膜带上和一个J型热电偶组成。将该组件保持在37 / spl℃/℃。对于这些条件,一式三份地进行了三组测量:A)没有材料; B)粘结剂; C)粘合剂+ 2毫米复合材料。在暴露于光10、20、30和40秒后记录温度,并在表中给出。每个组的体温均升高。当没有材料存在时,最大的温度升高为42.5 / spl℃/℃。粘合剂的放置使最大温度升高31.6 / spl℃/℃,而复合材料的固化由于其起绝缘体的作用,仅使温度升高9.5 / spl℃/℃。这些结果表明,即使光源距暴露表面3 mm,深层修复体中粘合剂的固化也可能使牙本质表面暴露于显着的温度升高。

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