Application of surface mount technology for biomedical microsensor interconnections

摘要

A method of connecting flexible electrode arrays to a flat cable or a flexible circuit is described. Solderpaste printing and reflow soldering techniques (as used in surface mount technology) are used to make a solder connection between a fine pitch flat cable and the bondpads on an electrode array. An epoxy and silicone encapsulation is added to achieve reliable connections for cardiovascular applications.