Thermal analysis and management of aerospace equipment using computer techniques

摘要

Changes in electronic technologies have led to significant increases in the power densities of components. To ensure that component reliabilities are not degraded, these trends have to be matched by improvements in thermal management techniques, supported by quick and accurate computer thermal analysis tools. The author discusses the use and development of such tools at British Aerospace, such that all heat transfer processes, from the junction of the smallest chip to the ambient air can be assessed and modelled. To illustrate the use of these techniques, he describes the toughest of examples: the cooling of a military system in a hostile natural environment.