A packaging approach is described which maximizes IC density and minimizes those complexities which degrade reliability. It emphasizes the reduction of parts count along with a high degree of functional integration to achieve these goals. The packaging and interconnection technologies required to maximize density and reliability are under development at Allied-Signal and through cooperative efforts with appropriate government agencies full-scale interconnect modules could be produced to verify performance. It is found that a single board implementation with no prepacked die is the optimum configuration. A module becomes a large hybrid circuit in the sense that it integrates several technologies on a single substrate.
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