首页> 外文会议>Materials Science amp; Technology 2003 Meeting; Nov 9-12, 2003; Chicago, Illinois, USA >INTERFACIAL CONDITIONS AT THE MOVING INTERFACE DURING GROWTH OF FERRITE FROM AUSTENITE IN FE-C-(X) ALLOYS
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INTERFACIAL CONDITIONS AT THE MOVING INTERFACE DURING GROWTH OF FERRITE FROM AUSTENITE IN FE-C-(X) ALLOYS

机译:FE-C-(X)合金中铁素体从奥氏体生长过程中运动界面的界面条件

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摘要

A quantitative description of the kinetics of ferrite growth in Fe-C-(X) systems requires the identification of the compositions of the ferrite (α) and austenite (γ) at the migrating interface and their change with time, temperature and bulk composition. Based on a sharp interface model, local equilibrium (LE) (with partitioning (LE-P) or with negligible partitioning (LE-NP)) and paraequilibrium (PE) represent two possible sets of interfacial conditions describing steady state growth where it is assumed that zero free energy is dissipated by interfacial processes. In this contribution we illustrate the expected deviations in interfacial conditions arising from non-negligible interfacial dissipations (finite interface mobility, solute drag) and compare the theoretical treatments with the available experimental data in the binary Fe-C and ternary Fe-C-Si systems. At the temperatures examined and the interface velocities experimentally encountered, the assumption of zero free energy dissipation by interfacial processes was found to be an excellent assumption. The binary Fe-C data is well explained by the LE model and the available data in the Fe-C-Si system is equally well described by the LE or PE treatments. The conclusion is made that under the treatment conditions examined, the mobility of the migrating interface is large enough that it may be safely assumed to be infinite and that negligible free energy dissipation due to Si diffusion within the migrating interface (solute drag) is observed.
机译:对Fe-C-(X)系统中铁素体生长动力学的定量描述,需要确定迁移界面处的铁素体(α)和奥氏体(γ)的组成及其随时间,温度和体积组成的变化。基于尖锐的界面模型,局部平衡(LE)(带有分隔(LE-P)或可忽略的分隔(LE-NP))和超平衡(PE)代表了两种可能的界面条件集,描述了假定的稳态生长界面过程消散了零自由能。在这一贡献中,我们说明了由于不可忽略的界面耗散(有限的界面迁移率,溶质阻力)而引起的界面条件的预期偏差,并将理论处理与二元Fe-C和三元Fe-C-Si系统中的可用实验数据进行了比较。在检查的温度和实验遇到的界面速度下,发现界面过程零自由能消散的假设是一个很好的假设。 LE模型很好地解释了二元Fe-C数据,LE或PE处理同样很好地描述了Fe-C-Si系统中的可用数据。得出的结论是,在检查的处理条件下,迁移界面的迁移率足够大,可以安全地假定为无限大,并且观察到由于迁移界面内的Si扩散(溶质阻力)而产生的可忽略的自由能消散。

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