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SMC Curing Simulation

机译:SMC固化模拟

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摘要

SMC curing properties are being measured with many kinds of procedures all over the world, and they are the most important factors for molding. But, it is very difficult to predict SMC curing properties because SMC consists of many kinds of ingredients. Measuring temperature in the middle of SMC plies with a thermocouple is so convenient that it is widely adopted to curing properties evaluation. Time-temperature curve involves many factors, for example, thermal conductivity, radical generation and polymerization. SMC curing is affected by combination of these factors.
机译:SMC的固化性能在世界范围内通过多种方法进行测量,它们是成型的最重要因素。但是,由于SMC由多种成分组成,因此很难预测SMC的固化性能。用热电偶测量SMC层中部的温度非常方便,因此已广泛用于固化性能评估。时间-温度曲线涉及许多因素,例如热导率,自由基的产生和聚合。这些因素共同影响SMC固化。

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