首页> 外文会议>Low temperature electronics and high temperature superconductivity >SUITABILITY OF SrTiO_3/YBa_2Cu_3O_(7-δ)/LaAlO_3 AND Ba_xSr_(1-x)TiO_3/LaAlO_3 THIN FILM MULTILAYER STRUCTURES FOR TUNABLE MICROWAVE DEVICES
【24h】

SUITABILITY OF SrTiO_3/YBa_2Cu_3O_(7-δ)/LaAlO_3 AND Ba_xSr_(1-x)TiO_3/LaAlO_3 THIN FILM MULTILAYER STRUCTURES FOR TUNABLE MICROWAVE DEVICES

机译:可调谐微波设备的SrTiO_3 / YBa_2Cu_3O_(7-δ)/ LaAlO_3和Ba_xSr_(1-x)TiO_3 / LaAlO_3薄膜多层结构的适用性

获取原文
获取原文并翻译 | 示例

摘要

We report on the characterization of thin film multilayer structures of SrTiO_3/YBa_2Cu_3O_(7-δ)/LaAlO_3 (STO/YBCO/LAO) and Ba_xSr_(1-x)TiO_3/ LaAlO_3 (BSTO/LAO), for x = 0, and x = 0.50, in terms of ferroelectric film deposition, device geometry and tunability. Material properties effects were assessed by varying the ferroelectric deposition temperature from to 800 to 250 ℃. Geometric aspects were considered by testing these structures in the parallel plate and interdigital capacitor configurations. Measurements of the relative dielectric constant (ε_r) and the loss tangent (tanδ) were made as a function of temperature (300 to 20 K), at a frequency of 1.0 MHz, and at dc electric fields from 0 to 3.5×10~5 V/cm. These measurements allowed us to determine (K = (ε_(max) - ε_(min))/rn(ε_(max))×(tanδ)~(-1) ), which is a figure of merit for the tunability to loss ratio of a given component. We observed that interdigital structures exhibited a larger K than parallel plate capacitors, but at the expense of a larger dc bias. Incorporation of a 300 nm thick ferroelectric film between the substrate and the conducting layer of non-tunable microwave components was investigated. The effect of the ferroelectric layer on the performance of a band reject, 20 GHz Au/STO/LAO ring resonator was minimal. Finally, an insertion phase shift of 17.5° and a frequency shift of 90 MHz were measured at 77 K and 20 GHz for Au/STO/LAO interdigital coupled microstrip line and ring resonator, respectively, for a dc bias of 100 V.
机译:我们报告了x = 0时SrTiO_3 / YBa_2Cu_3O_(7-δ)/ LaAlO_3(STO / YBCO / LAO)和Ba_xSr_(1-x)TiO_3 / LaAlO_3(BSTO / LAO)的薄膜多层结构的表征在铁电膜沉积,器件几何形状和可调性方面,x = 0.50。通过将铁电沉积温度从800℃更改为250℃来评估材料性能的影响。通过在平行板和叉指电容器配置中测试这些结构来考虑几何方面。相对介电常数(ε_r)和损耗角正切(tanδ)随温度(300至20 K),在1.0 MHz频率和0至3.5×10〜5的直流电场下进行测量V /厘米这些测量值使我们能够确定(K =(ε_(max)-ε_(min))/ rn(ε_(max))×(tanδ)〜(-1)),这是损耗可调性的品质因数给定组件的比率。我们观察到,叉指结构比平行板电容器表现出更大的K,但是以更大的直流偏置为代价。研究了在基板和不可调谐微波组件的导电层之间掺入300 nm厚的铁电膜。铁电层对带阻,20 GHz Au / STO / LAO环形谐振器性能的影响最小。最后,对于100 V的直流偏置,对于Au / STO / LAO叉指耦合微带线和环形谐振器,分别在77 K和20 GHz下测量了17.5°的插入相移和90 MHz的频移。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号