Laser-formed structures to facilitate TAB bonding

摘要

Abstract: A laser heating process was used to form structures which facilitate tape automated bonding (TAB). Uniform metal spheroids were created by melting the end of each TAB conductor intended for connection to the terminal pads of an integrated circuit (IC). A fully automated laser tool designed and built to fabricate these structures is described. Results for ICs bonded using this technology are presented.!2