Heriot-Watt University, Applied Optics and Photonics Group, School of Engineering and Physical Sciences, Edinburgh, EH 14 4AS, UK;
rnHeriot-Watt University, Applied Optics and Photonics Group, School of Engineering and Physical Sciences, Edinburgh, EH 14 4AS, UK;
rnHeriot-Watt University, Applied Optics and Photonics Group, School of Engineering and Physical Sciences, Edinburgh, EH 14 4AS, UK;
rnHeriot-Watt University, MIcroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Edinburgh, EH14 4AS, UK;
rnHeriot-Watt University, MIcroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Edinburgh, EH14 4AS, UK;
laser joining; localised heating; wafer-level; vacuum packaging;
机译:玻璃熔块作为基于激光的微型设备连接中的气密连接层
机译:低温光电设备,包装和材料的评论
机译:光电设备的包装调查
机译:基于激光的微型光电器件包装的连接
机译:小型封装提高光电器件热性能的包装和组装材料的研究
机译:硝化纤维素中流体设备的基于激光的图案化
机译:光电器件8的互连和包装技术的图形介绍。对齐,光电器件包装的同义词。
机译:玻璃,塑料和半导体:微型光电元件的封装技术。