首页> 外文会议>Laser applications in microelectronic and optoelectronic manufacturing (LAMOM) XVII >Picosecond fiber laser microfabrication of THz wire-grid polarizers on polymer membrane substrates
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Picosecond fiber laser microfabrication of THz wire-grid polarizers on polymer membrane substrates

机译:在聚合物膜基底上的太赫兹线栅偏振器的皮秒光纤激光微加工

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Ultrafast picosecond lasers provide the gentle cold ablation required to selectively remove a 400 nm metal film from an unsupported ultra-thin polymer membrane without damaging the membrane substrate. Selected areas of the metal film are completely removed in an ablative lift-off process enabled by a single laser pulse. No damage to the polymer membrane is observed even for samples with the metal completely removed over a 50×50 mm area of the membrane. The 400 nm thick metal films can be patterned into arbitrary forms with feature sizes as small as 10 micrometers, and even submicron features are realistically possible with a modification to the processing system. The skin depth of aluminium in the THz regime is significantly shorter than the 400 nm metal thickness, so thicker metal films that are significantly more difficult to machine are not beneficial. As an example, thin-film wire grid polarizers for the THz regime are demonstrated. The thin-film polarizers are much easier and faster to fabricate than polarizers made by winding free-standing wires around a frame and their performance is very comparable. The thin-film polarizers also have the added benefit of a significantly higher potential for functionality deeper in to the THz spectrum due to their capacity for smaller feature sizes. More intricate patterns, such as meshes, can also be made to create THz bandpass filters. This method can be extended to cold ablation processing of multilayer films fabricated on thin polymer substrates for applications such as plastic electronics, displays and solar cells.
机译:超快皮秒激光提供了柔和的冷烧蚀,可从不支撑的超薄聚合物膜上选择性去除400 nm金属膜,而不会损坏膜基底。金属膜的选定区域在单个激光脉冲的烧蚀剥离过程中被完全去除。即使对于在膜的50×50 mm区域完全去除金属的样品,也没有观察到对聚合物膜的损坏。可以将400 nm厚的金属膜图案化为特征尺寸小至10微米的任意形式,而实际上,只要对处理系统进行修改,就可以实现亚微米特征。太赫兹模式下铝的趋肤深度明显短于400 nm金属厚度,因此较难加工的较厚金属膜无益。例如,演示了用于THz方案的薄膜线栅偏振器。薄膜偏振器比通过在框架上缠绕自立电线制成的偏振器容易制造和制造更快,并且其性能非常可比。薄膜偏振器还具有额外的好处,因为它们具有较小的特征尺寸,因此具有显着更高的潜力,可用于更深的THz光谱功能。也可以制作更复杂的图案(例如网格)以创建THz带通滤波器。该方法可以扩展到在薄聚合物基板上制造的多层膜的冷烧蚀工艺,以用于塑料电子,显示器和太阳能电池等应用。

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