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Dynamic power analysis under laser stimulation:a new Dynamic Laser Simulation approach

机译:激光刺激下的动态功率分析: r na一种新的动态激光仿真方法

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Dynamic Laser Stimulation (DLS) techniques proved to be very efficient in soft defect localization bringing a lot of information about the device internal behavior. We need to use external parameter measurements such as frequency, delay, voltage etc to perform these techniques. So they can't be used to study internal signal propagation problems in latched device since signals are resynchronized. We will show that we can use the power analysis coupled with DLS techniques set up to characterize soft defect when we don't have a direct access to monitored signal propagation such as in some transistor transition issues. Laser stimulation in addition of power analysis is used to decrypt security codes in security chip, but in failure analysis it is a new way to reach internal information in order to localize soft defects.
机译:动态激光刺激(DLS)技术被证明在软缺陷定位方面非常有效,带来了许多有关设备内部行为的信息。我们需要使用外部参数测量(例如频率,延迟,电压等)来执行这些技术。因此,由于信号是重新同步的,因此它们不能用于研究锁存设备中的内部信号传播问题。我们将证明,当我们无法直接访问受监控的信号传播时(例如在某些晶体管转换问题中),可以将功率分析与DLS技术结合使用来表征软缺陷。除了功率分析外,还使用激光激励来解密安全芯片中的安全代码,但是在故障分析中,这是一种获取内部信息以定位软缺陷的新方法。

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