The emerging technology known as 'flipchips' is poised to take over the world of the portable device. In an age when more and more power and functionality is being offered in ever smaller packages, the flipchip will become mainstream in delivering the promise of "Information at Your Fingertips, Anytime, Anywhere".rnFlipchip technology places a specially prepared silicon chip onto a substrate for connection to other chips and to the outside world. Also known as Direct Chip Attach, it uses no traditional packaging, no bond wires, has no lead frame, and has a number of significant advantages and disadvantages compared to current mainstream technology.rnA conventional package has these features:rn1. Adds size and weight to the original silicon diern2. Adds environmental protectionrn3. Provides for easier handlingrn4. Provides easier post-package and pre-assembly testingrn5. Provides all the advantages of standard footprintsrn6. Provides geometric re-distribution for external connectionsrn7. Creates mechanical stress relief for thermal excursions.
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