The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB

摘要

PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manufacturing process for multi-layer PCBs with PTFE focusing on material specifications of anti-overflow and surface treatment techniques, thereby addresses the feasibility of this technology.