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Oxidation and Topography of Powder in Pb-free Solder Paste

机译:无铅焊膏中粉末的氧化和形貌

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With Pb-free soldering materials 'Heat' is the most important parameter. Despite the fact that our industry has to switch to Pb-free technology, the ever increasing demands for higher quality in the final electronic product is the driving force to achieve more consistent material performance. The introduction of Pb-free technology has presented additional challenges to deliver more batch-to-batch consistency of solder paste. It is not only the consistency of the flux system with a higher thermal stability that has received more attention but also, as described in this paper, a number of surface properties of the powder, impacting the interaction with the flux system, that have recently received greater recognition as important parameters. Surface roughness and the differences in the alloy between the mass of the solder particle and its specific surface area not only impact the wetting properties of a solder paste but also its rheology and consequently its printing properties.rn1. We strongly believe that getting more control over the oxide content becomes a key element in the successful application of Pb-free solder paste.rn2. An oxygen content analysis with the high temperature fusion furnace method seems to be an insignificant procedure. Although it may claim a level of repeatability, its resolution is considerably lower than the oxide level analysis by the fusion-in-oil principle.rn3. The ratio of fines in a particle range has a significant impact on the oxide level.rn4. Air oxidation doesn't have such an influence on oxide level at ambient temperatures.rn5. Solidification seems to have a minor influence on oxide level and yet quite a significant one on topography of solderrnpowder.rn6. Even if it would turn out that AFM would be a fundamentally correct method to establish both oxide layersrn(indirectly) and surface-topography, we would still require a justification of the cost per analysis versus the potentialrnto detect process variations.rn7. If AFM data only become meaningful when supported by EDX results, this technique has no chance to become arnfeasible detection routine. However, it will still be functional in supporting and guiding process improvements.
机译:对于无铅焊接材料,“热”是最重要的参数。尽管我们的行业必须转换为无铅技术,但最终电子产品对更高质量的不断增长的需求却是实现更一致的材料性能的动力。无铅技术的引入带来了更多挑战,以实现焊膏之间批次之间的一致性。不仅引起了更高热稳定性的助焊剂系统的一致性受到了越来越多的关注,而且,正如本文所述,粉末的许多表面性质也影响了与助焊剂系统的相互作用,最近受到了关注。作为重要参数得到更大的认可。表面粗糙度和焊料颗粒的质量与其比表面积之间的合金差异不仅会影响焊膏的润湿性能,而且还会影响其流变性和印刷性能。我们坚信,更好地控制氧化物含量已成为无铅焊膏成功应用的关键因素。用高温熔炉法进行氧含量分析似乎是微不足道的过程。尽管它可能要求一定程度的可重复性,但其分辨率大大低于通过油中融合原理进行的氧化物水平分析。颗粒范围内的细粉比例对氧化物含量有重要影响。空气氧化对环境温度下的氧化物含量没有如此影响。固化似乎对氧化物含量影响很小,但对焊粉的形貌影响很大。即使事实证明,原子力显微镜是建立(间接)氧化层和表面形貌的根本正确方法,我们仍然需要证明每次分析的成本与检测工艺变化的潜力。如果只有在EDX结果支持下AFM数据才有意义,则该技术没有机会成为可行的检测程序。但是,它仍将在支持和指导流程改进方面发挥作用。

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