Stacked-Die Analysis Using C-Mode Scanning Acoustic Microscope

摘要

For stacked die package delamination inspection using C-mode acoustic microscope, traditional interface and through scan techniques can not give enough of information when the delamination occurs in multi-interfaces, and echoes from adjacent interfaces are not sufficiently separated from each other, as demonstrated in this paper. It is recommended that different CSAM modes be applied in order to identify the delamination interface(s) and avoid misreading and misinterpreting the information. Note: Please contact the author if an original color figure is needed.