首页> 外文会议>International Symposium on Novel Materials Processing by Advanced Electromagnetic Energy Sources; 20040319-22; Osaka(JP) >Intergranular Microstructure of Yb_2O_3-added AlN Sintered by Millimeter-Wave Heating
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Intergranular Microstructure of Yb_2O_3-added AlN Sintered by Millimeter-Wave Heating

机译:毫米波加热烧结Yb_2O_3的AlN的晶间微观结构。

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摘要

Aluminum nitride was sintered by 28GHz millimeter-wave heating method, and the relation between thermal conductivity and microstructure in the sintered AlN was investigated. Aluminum nitride with high thermal conductivity over 200W/(m·K) was obtained by millimeter-wave-sintering at low temperature of 1700℃ for 2hrs under nitrogen/hydrogen mixed gas atmosphere. From the observation by HR-TEM, intergranular layer in AlN sintered by millimeter-wave heating was thinner than that sintered by conventional heating. The high thermal conductivity over 200W/(m·K) of the millimeter-wave sintered AlN is attributed to the formation of the thin intergranular layer in spite of a short sintering time and low sintering temperature, as compared with conventional sintering methods.
机译:通过28GHz毫米波加热法对氮化铝进行烧结,研究了AlN的热导率与组织的关系。在氮气/氢气混合气体气氛下,于1700℃的低温下进行毫米波烧结2小时,制得导热系数超过200W /(m·K)的氮化铝。通过HR-TEM观察,通过毫米波加热烧结的AlN中的晶界层比通过常规加热烧结的Al的晶界层薄。与常规烧结方法相比,尽管烧结时间短且烧结温度低,但是毫米波烧结AlN的200W /(m·K)以上的高导热率归因于薄的晶间层的形成。

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