Thermomechanical properties of AIN-Cu composite materials prepared by solid state processing

摘要

This study investigates coefficients of thermal expansion (CTE) and thermal conductivity (TC) of pulse electric current sintered mechanical alloying (MA) AIN-Cu powder compacts for the heat sink material application. The CTEs of MA AIN-Cu powder compacts showed good consistency with Turner's model when the volume fraction of copper was less than 60%, even in presence of some pores. When it was more than 60%, the values of thermal expansion had good agreement with the rule of mixtures. The porosity compensated TCs of AlN-40, 60, and 80 vol.% Cu measured at 200℃ were 62.7, 82.2, and 95.1 W m~(-1) K~(-1).