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AN EQCM ANALYSIS OF PASSIVATION PROCESS OF COPPER THIN FILM

机译:铜薄膜钝化过程的EQCM分析

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摘要

The passivation processes of copper thin films in deaerated borate soultions of pH 6.5 - 8.4 were analyzed by an electrochemical quartz crystal microbalance (EQCM). The simultaneous measurement of changes in mass and current has succeeded in separating the anodic current flowed during passivation into two partial currents of passive film growth, i_o2-, and metal dissolution through the film, i_(Cu)2+. It was found that the linear relation between log i_o2- and log i_(Cu)2+ held, from which the ratios of the transfer coefficients, α_o2- / α_(Cu)2+ ,were obtained. The average value of α_o2- / α_(Cu)2+, thus obtained was nearly unity, independent of potential and solution pH. Moreover, EQCM could monitor the breakdown process of the passive film due to an addition of SO_4~(2-) to pH 8.4 borate solution.
机译:用电化学石英晶体微量天平(EQCM)分析了pH为6.5-8.4的脱气硼酸盐溶液中铜薄膜的钝化过程。质量和电流变化的同时测量已成功地将钝化过程中流动的阳极电流分为两部分,分别是钝化膜生长i_o2-和通过膜的金属溶解i_(Cu)2+。发现log i_o2-和log i_(Cu)2+之间保持线性关系,从中获得了传递系数α_o2-/α_(Cu)2+的比率。由此获得的α_o2-/α_(Cu)2+的平均值几乎为1,与电势和溶液pH无关。此外,由于在pH 8.4硼酸盐溶液中加入了SO_4〜(2-),EQCM可以监测钝化膜的击穿过程。

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