Photoinitiated Epoxy Resins -Innovative Adhesive Systems for use in the field of Flexible Printed Boards

机译：光引发性环氧树脂-用于柔性印制板领域的创新粘合剂系统

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In the following photoinitiated adhesive systems are presented which due to their outstanding material properties are ideally suited for use on microelectronic applications. Here, the use of these products in the field of flexible printed boards are considered.

机译：在下文中，提出了光引发的粘合剂体系，由于其优异的材料性能，它们非常适合用于微电子应用。在此，考虑了这些产品在柔性印刷电路板领域的使用。

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来源
《International symposium on electronic packaging technology;ISEPT; 19961209-12;19961209-12; Shanghai(CN);Shanghai(CN)》|1996年|P.32|共1页
会议地点 Shanghai(CN)
作者
Patrick Marx;
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DELO Industrieklebstoffe GmbH Co.KG Ohmstrasse 3, D-86899 Landsberg / Lech, Germany;

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原文格式 PDF
正文语种 eng
中图分类封装及散热问题;
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1. SABIC's new Noryl * SA resins cut cost and extend performance capabilities of thermoset systems for printed circuit boards (PCBs), adhesives and coatings [J] . Pigment amp, Resin Technology Group Pigment & Resin Technology . 2013,第1期

机译：SABIC的新型Noryl * SA树脂降低了成本，并扩展了热固性体系的性能，适用于印刷电路板（PCB），粘合剂和涂料
2. Dissolution of brominated epoxy resin for environment friendly recovery of copper as cupric oxide nanoparticles from waste printed circuit boards using ammonium chloride roasting [J] . Panda Ramdayal, Pant Kamal Kishore, Bhaskar Thallada, Journal of Cleaner Production . 2021,第Apra1期

机译：溴化环氧树脂对环境偏重回收铜作为氯化铵电路板铜氧化物纳米粒子的溶解
3. Microwave-assisted chemical recovery of glass fiber and epoxy resin from non-metallic components in waste printed circuit boards [J] . Kaiyou Huang, Jiongli Zheng, Wenyi Yuan, Waste Management . 2021,第Apra期

机译：废物印刷电路板中的非金属组分微波辅助玻璃纤维和环氧树脂的化学回收
4. Photoinitiated Epoxy Resins -Innovative Adhesive Systems for use in the field of Flexible Printed Boards [C] . Patrick Marx International symposium on electronic packaging technology . 1996

机译：光灭绝的环氧树脂 - 用于柔性印刷电路板领域的无效粘合剂系统
5. Optimization of epoxy resins for chemical anchor adhesives and molding compounds. [D] . Liu, Wen-Feng. 2006

机译：优化化学锚固粘合剂和模塑料的环氧树脂。
6. Printed Circuit Board-Derived Glass Fiber-Epoxy Resin-SupportedMo–Cu Bimetallic Catalyst for Glucose Synthesis [O] . Sourav Barman, Rajat Chakraborty, * 2018

机译：印刷电路板衍生的玻璃纤维环氧树脂支持Mo-Cu双金属催化合成葡萄糖
7. Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field [O] . Zhijun Diao, Yuemin Zhao, Bo Chen, 2012

机译：采用REAXFF反应力场从无功动力学中包含的印刷电路板环氧树脂的热分解

Photoinitiated Epoxy Resins -Innovative Adhesive Systems for use in the field of Flexible Printed Boards

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