首页> 外文会议>International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces Mar 11-14, 2001 Chateau Elan, Braselton, Georgia >A Method to Quantify the Surface Insulation Resistance Performance of Glob Tops Exposed to Different Temperature/Humidity Combinations
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A Method to Quantify the Surface Insulation Resistance Performance of Glob Tops Exposed to Different Temperature/Humidity Combinations

机译:量化不同温度/湿度组合下的电焊条表面绝缘性能的一种方法

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摘要

Often the only information that suppliers of encapsulant glop top and dam and fill materials provide for users of their materials is a single value of surface insulation resistance. This datum provides very little information about the performance of the encapsulant over the wide range of different humidity/temperature conditions that it may encounter in its service life. This procedure describes a simple method for characterising the performance of encapsulant materials over a broad range of environmental conditions. The resultant data can be used to assess the performance of different manufacturers formulations or types of encapsulant dispensed on to different board finishes or on to different board materials.
机译:通常,密封胶水顶和坝和填充材料的供应商为用户提供的唯一信息是表面绝缘电阻的单个值。该数据几乎没有提供有关密封剂在其使用寿命中可能遇到的各种不同湿度/温度条件下的性能的信息。此过程描述了一种简单的方法,用于表征密封剂材料在各种环境条件下的性能。所得数据可用于评估不同制造商的配方或分配在不同板材饰面或不同板材上的密封胶类型的性能。

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