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PROTON IRRADIATION EFFECTS IN SILICON DEVICES

机译:硅器件中的质子辐照效应

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摘要

Proton irradiation effects in silicon devices are studied for components fabricated in various substrates in order to reveal possible hardening effects. The degradation of p-n junction diodes increases in first order proportionally with the fluence, when submitted to 10 MeV proton irradiations in the range 5×10~9 cm~(-2)2 to 5×10~(11) cm~(-2). The damage coefficients for both p- and n-type Czochralski, Float-Zone and epitaxial wafers are reported. Charge-Coupled Devices fabricated in a 1.2 μm CCD-CMOS technology are shown to be quite resistant to 59 MeV H~+ irradiations, irrespective of the substrate type.
机译:研究了硅器件中质子的辐照效应,以研究在各种基板上制造的组件,以揭示可能的硬化效应。当在5×10〜9 cm〜(-2)2到5×10〜(11)cm〜(-2)范围内进行10 MeV质子辐照时,pn结二极管的退化与注量成比例地增加。 )。报告了p型和n型Czochralski,Float-Zone和外延晶片的损伤系数。事实证明,采用1.2μmCCD-CMOS技术制造的电荷耦合器件对59 MeV H〜+辐射具有很强的抵抗力,与衬底类型无关。

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