Novel SOI Driver SmartPACK/SmartPIM Modules for Low-power Drive Applications

摘要

A novel 600 V/0.3 A 6-pack IGBT/MOSFET driver IC named 6ED003L06-F is developed based on the SOI technology. It realizes 3-phase level-shift, gate drive and protection functions in a single IC with reduced chip size and improved performance such as the robustness to negative transient voltage. A new series of IPM named SmartPACK/SmartPIM is developed by integrating the SOI driver, 600 V IGBT~3 and boot-strap function in a compact housing based on the DCB substrate without the baseplate. It is available in 6 A to 20 A ratings and offers a compact and cost-effective solution with design and process simplifications to low-power drives especially consumer drive applications.