Highly Integrated Tire Pressure Monitoring Solutions

摘要

This paper is presenting a new tire pressure monitoring (TPM) sensor that offers a high level of functional integration by combining a 0.8 μm CMOS surface micro machined capacitive pressure sensing element with a 0.35μm SmartMOS ~(TM) ASIC into a single small outline 16 pin package. The pressure sensor feature low voltage, low power operation, and include an on-chip CMOS radio frequency (RF) transmitter, a low frequency (LF) receiver, a temperature sensor, a voltage sensor as well as embedded motion sensing capability. The data processing is performed by the high logic gate density programmable state machine and associated non-volatile memory containing the device settings. Several mission profiles and operating modes can be programmed to comply either with the US Federal Motor Vehicle Safety Standard 138 or with any other existing car manufacturer requirements throughout the world.