Modeling of Heat Flow and Solidification during Spray Deposition

摘要

Solidification behavior of droplets as well as spray-deposits have been investigated during spray deposition of a melt. The results indicate that the cooling rate of a wide size range of droplets of Al-4.5 Cu alloy varies from 10~3 to 10~5 Ks~(-1) in contrast to a slow cooling rate of 1 to 10 Ks~(-1) of the spray deposit. The spray enthalpy on the deposition surface increases with an increase in the melt superheat. The atomization gas pressure does not have a significant influence on the enthalpy of the spray. The cooling rate of the deposits predicted from the model compares well with those obtained by the measurements.