Building drives based on new module standards

摘要

IGBT-modules are the most frequently used semiconductors for power applications. The market demand for higher power integration in one module is limited by the chip losses and the housing capability to dissipate the power. With the 3rd generation of 1200V IGBT modules eupec presents a product line with up to 50% higher current density in the same housing. In addition to familiar housings two new housing standards EconoPACK + and EasyPIM were introduced. To utilize the advantages of these packages it is necessary to keep a few design considerations in mind. This paper will give hints and tricks on the design of cooling, mounting and driver stages as well as paralleling. Although these application notes will be based on the above mentioned new standard modules, they are also relevant for other modules.