THERMAL PERFORMANCE OF MIM THERMAL-MANAGEMENT DEVICE

摘要

As processors are getting faster and hotter, heat dissipation becomes an important thermal issue to be considered. In recent years, there are many new developments in thermal management devices in order to overcome the thermal barrier. The design started from common thermal management device of passive heat sinks with mounted fan to heat pipe and now the solvent transportation. The conventional manufacturing processes for most heat sinks are extrusion, forging, machining and die-casting. However, Metal Injection Molding (MIM) is gaining recognition lately as a good and economical means to fabricate intricate heat sinks for more sophisticated thermal design system. This paper highlighted the thermal performance of MIM heat sink compared with other conventional process.