Damage Mechanics of Solder Joints Under High Current Density

摘要

In this paper, Moire interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (10~4A/cm~2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moire interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.