NUMERICAL EVALUATION ON THE COOLING CAPABILITY OF MEMS BASED LIQUID METAL COOLING DEVICE USED IN HARSH ENVIRONMENT

摘要

The thermal management of the increasing fast chips has been a major concern in packaging of microano systems [1]. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. It is expected that heat flux levels in excess of 100 W/cm 2 for commercial electronics and over 1000 W/cm 2 for selected military high power electronics will soon become a realistic challenge to overcome. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as micro-systems, sensors and actuators, and microano electronic components.