School of Microelectronics, Xi’an Jiaotong University, Xi’an, China;
School of Microelectronics, Xi’an Jiaotong University, Xi’an, China;
School of Microelectronics, Xi’an Jiaotong University, Xi’an, China;
Xi’an Microelectronics Technology Institute, Xi’an, China;
Through-silicon vias; Micromechanical devices; Load modeling; Silicon; Integrated circuit modeling; Ceramics;
机译:沉积的纳米粒子可以促进压电喷墨打印头喷嘴的空气堵塞
机译:多普勒振动试验和数值模拟的压电喷墨打印头波形设计方法
机译:基于系统动力学模型的压电喷墨打印头驱动波形的优化
机译:全集成压电喷墨打印头模块的高压驱动器
机译:高效全集成开关电容DC-DC转换器的分析建模与设计和高压电流调节器
机译:基于集总模型的MEMS压电驱动循环喷墨打印头设计与特性分析
机译:压电喷墨打印头内部电力法流体的建模