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Wet erosion of liquid phase sintered alumina

机译:液相烧结氧化铝的湿蚀

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A study has been made of the mechanism of wet erosive wear of polycrystalline alumina. The aluminas were prepared with controlled grain size, and contained up to 10percent by weight of magnesium silicate sintering aid. For materials of grain size < 1 mum the dominant wear mechanism appeared to be tribochemical, giving polishing with a very low material removal rate. For coarser grain size materials the wear mechanism appeared to involve microfracture initiation and propagation, leading to partial or complete grain removal. For pure alumina materials fracture was predominantly intergranular with crack interlinking; for the liquid phase sintered materials fracture was mainly transgranulr. The presence of the magnesium silicate sintering additive decreased the wear rates considerably, compared to pure alumina materials of the same mean grain size. No correlation was found between wear rates and Vickers indentation hardness and fracture toughness values. However, use of a depth sensing nanoindentation technique revealed differences between the pure and the magnesium silicate doped aluminas, with the pure alumina being stiffer and harder. Grain facetting was also a strong feature of the nanoindentation damage zones in the case of pure alumina, providing supporting evidence that crack development predominantly followed the grain boundaries. Magnesium silicate densified materials, in contrast, showed mainly intragranular fracture around the indentation crater. It is concluded that the wear process in alumina materials of mean grain size > 1 mum is at least partly dependent on the residual grain boundary stresses arising from the thermal expansion anisotropy of the alumina grains. The intergranular silicate film has two functions: it effectively strengthens the grain boundaries, and it increases the compliance of the material, so as to improve its ability to absorb and dissipate impact energy.
机译:已经对多晶氧化铝的湿法腐蚀磨损机理进行了研究。制备具有受控粒度的氧化铝,并包含至多10重量%的硅酸镁烧结助剂。对于晶粒尺寸小于1微米的材料,主要的磨损机理似乎是摩擦化学的,因此抛光时材料去除率非常低。对于粒度较大的材料,磨损机理似乎涉及微裂纹的产生和扩展,从而导致部分或全部去除晶粒。对于纯氧化铝材料,断裂主要是晶间和裂纹的交联。液相烧结材料的断裂主要是穿晶。与相同平均粒度的纯氧化铝材料相比,硅酸镁烧结添加剂的存在大大降低了磨损率。在磨损率与维氏压痕硬度和断裂韧性值之间未发现相关性。然而,使用深度感测纳米压痕技术揭示了纯硅酸铝和掺杂硅酸镁的氧化铝之间的差异,纯氧化铝变得越来越硬。在纯氧化铝的情况下,晶粒刻面也是纳米压痕损伤区的一个重要特征,提供了支持性证据,表明裂纹的发展主要遵循晶界。相比之下,硅酸镁致密化材料主要在压痕坑周围显示出晶内断裂。结论是,平均晶粒尺寸大于1微米的氧化铝材料的磨损过程至少部分取决于由氧化铝晶粒的热膨胀各向异性引起的残余晶粒边界应力。晶间硅酸盐膜具有两个功能:有效地增强晶界,增加材料的柔顺性,从而提高其吸收和消散冲击能量的能力。

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