首页> 外文会议>International Conference on ASIC; 20031021-20031024; Beijng; CN >Design Theory and Library Development of Vertical Dual Carrier Field Effect Transistor ASIC and SOC on SiO_2 and Insulating GaAs Substrate with Effective Channel Length of 5-30nm
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Design Theory and Library Development of Vertical Dual Carrier Field Effect Transistor ASIC and SOC on SiO_2 and Insulating GaAs Substrate with Effective Channel Length of 5-30nm

机译:SiO_2和有效沟道长度5-30nm的绝缘GaAs衬底上垂直双载流场效应晶体管ASIC和SOC的设计理论和库开发。

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摘要

Design theory and library development of Vertical Dual Carrier Field Effect Transistor (VDCFET) ASIC and SOC on SiO_2 and insulating GaAS substrate are presented for VDCFET with effective channel length of 5-30 nm. These ASIC and SOC can be designed for different materials. For different applications, these VDCFET have different equivalent circuits, thus different library development are described. It is to be emphasized that these VDCFET ASIC and SOC, with effective channel length of 5-30 nnm, can be fabricated with lithographic equipment for linewidths of 90 nm, 130 nm, 180 nm or more. The design theory of "Vertical Dual Carrier Field Effect Transistor" (VDCFET) is presented in this paper. It shall be illustrated that effective channel lengths as short as 5-30nm can be designed by proper choice of device dimensions, doping and device terminal voltages. The fabrication process of these VDCFET is compatible with that of CMOS, HBT and BiCMOS, using lithographic equipment for linewidths of 90nm, 130nm or 180nm. The number of transistors which can be integrated in each ASIC or SOC depends upon the lithographic equipment to be used.
机译:提出了有效沟道长度为5-30 nm的垂直双载子场效应晶体管(VDCFET)ASIC和SOC_2和绝缘GaAS衬底上的SOC的设计理论和库开发。这些ASIC和SOC可以设计用于不同的材料。对于不同的应用,这些VDCFET具有不同的等效电路,因此描述了不同的库开发。要强调的是,这些有效沟道长度为5-30 nm的VDCFET ASIC和SOC可以用光刻设备制造,其线宽为90 nm,130 nm,180 nm或更大。提出了“垂直双载流子场效应晶体管”(VDCFET)的设计理论。应当说明,可以通过适当选择器件尺寸,掺杂和器件端子电压来设计有效沟道长度,短至5-30nm。这些VDCFET的制造工艺与线宽为90nm,130nm或180nm的光刻设备兼容CMOS,HBT和BiCMOS。可以集成在每个ASIC或SOC中的晶体管数量取决于要使用的光刻设备。

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