Enabling Next Generation Microsystems by 3-D Assembly

摘要

This paper describes work being done at Zyvex Corporation to manufacture the next generation of MicroElectroMechanical Systems (MEMS) devices by assembling silicon piece parts to enable 3D MEMS devices. The method by which the devices are assembled is described along with sample applications of devices that have been enabled using this technique. The technique and devices have been proven to maintain mechanical integrity and also enable heterogeneous (non-silicon) assembly.