Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits

摘要

A high performance 3D dipole antenna with metal thickness >100 μm for wide bandwidth and lateral radiation is realized on InFO package. 25 % wide fractional bandwidth, from 60 to 77 GHz, has been obtained. The beamforming capability of the antenna array system with 6 dBi gain is measured in a 40 nm CMOS RFIC co-designed system.