Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates

摘要

In this study two different silver nanoparticle inks were characterized by thermogravimetric analysis to define promising sintering temperatures. The inks were printed on flexible polyimide as well as polyethylene terephthalate substrates. Online electrical resistance measurements of printed lines were conducted to specify certain durations for each sintering temperature. Printed Van der Pauw structures were sintered according to the determined parameter sets to investigate the influence of sintering temperature and duration on the adhesion. Sintering at temperatures less or equal to the maximum evaporation rate leads to an increasing adhesion on PI with prolonged sintering duration. Sintering above the maximum evaporation rate, leads to a fast increasing adhesion on PI peaking around 3 N/mm