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Fabrication of cantilever MEMs structure of C-axis grown AlN film for energy harvester application

机译:C轴生长AlN薄膜悬臂MEM结构的制备

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substrate by reactive magnetron sputtering method. Second, fabricated cantilever structure of deposited multilayered thin films using dry, followed by the wet etching process to complement each other to easily release the cantilever for MEMs piezoelectric energy harvester application. Deposited thin films characterized using x-ray diffraction (XRD) to confirm the c-axis oriented growth of AlN film and peak due to (110) plane of deposited molybdenum (Mo) film. Atomic force microscopy (AFM) was used to measure the surface roughness of films. Fabricated cantilever structures are characterized using field electron microscopy (FE-SEM). Measured full width of half maxima (FWHM) of deposited AlN and Mo films are 0.82 ° and 0.38° respectively, confirming good quality of films. Before, releasing of cantilever structures by the wet etching process, dry etching was used to help in easy to release and also reduced the cantilever releasing time. It was obverted that cantilevers were released within 1 hours 15 minutes using first, dry etching followed by the wet etching process, which is 2.5 times faster than only by wet etching process.
机译:反应磁控溅射法沉积衬底。其次,使用干法制造的沉积多层薄膜的悬臂结构,然后通过湿法蚀刻工艺相互补充,以轻松释放悬臂,以用于MEM压电能量收集器应用。使用X射线衍射(XRD)表征沉积的薄膜,以确认AlN膜的c轴取向生长以及由于沉积的钼(Mo)膜的(110)平面而导致的峰。原子力显微镜(AFM)用于测量薄膜的表面粗糙度。使用场电子显微镜(FE-SEM)对制成的悬臂结构进行表征。测得的沉积的AlN和Mo膜的半峰全宽(FWHM)分别为0.82°和0.38°,这证明了膜的良好质量。在通过湿蚀刻工艺释放悬臂结构之前,干蚀刻被用来帮助容易地释放并且还减少了悬臂的释放时间。可以观察到,首先使用干法刻蚀,然后进行湿法刻蚀,在1小时15分钟内释放出悬臂,这比仅湿法刻蚀的速度快2.5倍。

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