首页> 外文会议>Intermetallic-based alloys for structural and functional applications >Effects of additives on the phase stability of Nb_3Si intermetallic compound and mechanical properties of Nb-Si alloy
【24h】

Effects of additives on the phase stability of Nb_3Si intermetallic compound and mechanical properties of Nb-Si alloy

机译:添加剂对Nb_3Si金属间化合物的相稳定性和Nb-Si合金力学性能的影响

获取原文
获取原文并翻译 | 示例

摘要

Recently, Nb-Si alloys have attracted attentions as substitutional materials of Ni-based superalloys because of its low density and high melting point. For attaining good room temperature toughness of Nb-Si alloys, proposed is a microstructure-control technique by combining eutectic reaction (L->Nb+Nb_3Si) and eutectoid reaction (Nb_3Si->Nb+ Nb_5Si_3) for spheroidizing Nb_5Si_3 strengthening phase embedded in Nb matrix [1]. For the solid solution strengthening of Nb matrix phase W and Mo are very effective, but Nb_3Si phase disappears by adding these elements of as small as 3 at%. In contrast, Ti and Ta stabilize Nb_3Si phase. For a further alloy development, establishment of an alloy design based on the control of phase stability of Nb_3Si is needed. In the previous study [2], it was revealed that the phase stability of Nb_3Si can be controlled by selecting appropriate Ta/Mo ratio. In the present study, this approach is expanded to other combinations of stabilizing and destabilizing elements of Nb_3Si, such as Ti and W, Ta and W, and Ti and Mo. Vickers hardness tests were conducted on the heat-treated samples to reveal effects of additives on mechanical properties of Nb-Si alloy.
机译:近来,Nb-Si合金由于其低密度和高熔点而作为Ni基高温合金的替代材料引起了关注。为了获得Nb-Si合金的良好室温韧性,提出了一种通过将共晶反应(L-> Nb + Nb_3Si)和共析反应(Nb_3Si-> Nb + Nb_5Si_3)结合以使埋入Nb基体中的Nb_5Si_3强化相的微结构控制技术。 [1]。对于固溶强化,Nb基体相W和Mo是非常有效的,但是通过添加这些元素至3 at%则Nb_3Si相消失。相反,Ti和Ta稳定Nb_3Si相。为了进一步的合金开发,需要基于Nb_3Si的相稳定性的控制来建立合金设计。在先前的研究中[2],发现可以通过选择适当的Ta / Mo比来控制Nb_3Si的相稳定性。在本研究中,该方法扩展到了Nb_3Si的稳定元素和去稳定元素的其他组合,例如Ti和W,Ta和W以及Ti和Mo。对热处理过的样品进行了维氏硬度测试,以揭示碳化钨的影响。添加剂对Nb-Si合金力学性能的影响。

著录项

  • 来源
  • 会议地点 Boston MA(US);Boston MA(US)
  • 作者单位

    Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita-13, Nishi-8, Kita-ku, Sapporo 060-8628, Hokkaido, Japan,Graduate School of Engineering, Hokkaido University;

    Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita-13, Nishi-8, Kita-ku, Sapporo 060-8628, Hokkaido, Japan;

    Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita-13, Nishi-8, Kita-ku, Sapporo 060-8628, Hokkaido, Japan;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 半导体技术;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号